米6体育平台手机版

ZHCSFW7C december 2016 – september 2020 CC2640R2F

PRODUCTION DATA

8.26 Thermal Resistance Characteristics

NAME	DESCRIPTION	RSM (°C/W)⁽¹⁾⁽²⁾	RHB (°C/W)⁽¹⁾⁽²⁾	RGZ (°C/W)⁽¹⁾⁽²⁾	YFV (°C/W)⁽¹⁾⁽²⁾
Rθ_JA	Junction-to-ambient thermal resistance	36.9	32.8	29.6	76.2
Rθ_JC(top)	Junction-to-case (top) thermal resistance	30.3	24.0	15.7	0.3
Rθ_JB	Junction-to-board thermal resistance	7.6	6.8	6.2	16.3
Psi_JT	Junction-to-top characterization parameter	0.4	0.3	0.3	1.8
Psi_JB	Junction-to-board characterization parameter	7.4	6.8	6.2	16.3
Rθ_JC(bot)	Junction-to-case (bottom) thermal resistance	2.1	1.9	1.9	N/A

(1) °C/W = degrees Celsius per watt.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [Rθ_JC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air).
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements.

For RSM, RHB, and RGZ, power dissipation of 2 W and an ambient temperature of 70°C is assumed. For YFV, power dissipation of 1.3 W and ambient temperature of 25°C is assumed.