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ZHCSG14D October 2015 – October 2017 LMK61A2-100M , LMK61A2-125M , LMK61A2-156M , LMK61A2-312M , LMK61A2-644M , LMK61E0-050M , LMK61E0-155M , LMK61E0-156M , LMK61E2-100M , LMK61E2-125M , LMK61E2-156M , LMK61E2-312M , LMK61I2-100M

PRODUCTION DATA.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMK61XX ⁽²⁾⁽³⁾⁽⁴⁾			UNIT
		SIA (QFM)
		6 PINS
		Airflow (LFM) 0	Airflow (LFM) 200	Airflow (LFM) 400
R_θJA	Junction-to-ambient thermal resistance	55.2	46.4	43.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	34.6	n/a	n/a	°C/W
R_θJB	Junction-to-board thermal resistance	37.7	n/a	n/a	°C/W
ψ_JT	Junction-to-top characterization parameter	11.3	17.6	22.5	°C/W
ψ_JB	Junction-to-board characterization parameter	37.7	41.5	40.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The package thermal resistance is calculated on a 4 layer JEDEC board.

(3) Connected to GND with 3 thermal vias (0.3-mm diameter).

(4) ψJB (junction to board) is used when the main heat flow is from the junction to the GND pad. Please refer to Thermal Considerations section for more information on ensuring good system reliability and quality.