ZHCSGF2C July 2017 – June 2019 TLV743P
PRODUCTION DATA.
THERMAL METRIC(1) | TLV743P | UNIT | ||
---|---|---|---|---|
DBV (SOT-23) | DQN (X2SON) | |||
5 PINS | 4 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 228.4 | 218.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 151.5 | 164.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 55.8 | 164.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 31.4 | 5.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 54.8 | 163.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 131.4 | °C/W |