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ZHCSGK9B April 2017 – December 2017 TPS22971

PRODUCTION DATA.

THERMAL METRIC ⁽¹⁾		TPS22971	UNIT
		YZP (DSBGA)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	130	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	54	°C/W
R_θJB	Junction-to-board thermal resistance	51	°C/W
ψ_JT	Junction-to-top characterization parameter	1	°C/W
ψ_JB	Junction-to-board characterization parameter	50	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.