TI recommends following the recommendations set by the solder paste supplier to optimize flux activity and to achieve proper melting temperatures of the alloy within the guidelines of J-STD-20. Processing LMK62XX with the lowest peak temperature possible while also remaining below the components peak temperature rating as listed on the MSL label is preferred. The exact temperature profile would depend on several factors including maximum peak temperature for the component as rated on the MSL label, board thickness, PCB material type, PCB geometries, component locations, sizes, densities within PCB, as well as the recommended soldering profile from the manufacturer, and capability of the reflow equipment to as confirmed by the SMT assembly operation.