ZHCSGQ7C September   2017  – May 2019 TDP142

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      显示屏
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DisplayPort
      2. 8.3.2 4-level Inputs
      3. 8.3.3 Receiver Linear Equalization
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration in GPIO Mode
      2. 8.4.2 Device Configuration In I2C Mode
      3. 8.4.3 Linear EQ Configuration
      4. 8.4.4 Operation Timing – Power Up
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 General Register (address = 0x0A) [reset = 00000001]
        1. Table 6. General Registers
      2. 8.6.2 DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
        1. Table 7. DisplayPort Control/Status Registers (0x10)
      3. 8.6.3 DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
        1. Table 8. DisplayPort Control/Status Registers (0x11)
      4. 8.6.4 DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
        1. Table 9. DisplayPort Control/Status Registers (0x12)
      5. 8.6.5 DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
        1. Table 10. DisplayPort Control/Status Registers (0x13)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Source Application Implementation
        1. 9.2.1.1 Design Requirement
        2. 9.2.1.2 Detail Design Procedure
      2. 9.2.2 Sink Application Implementation
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage Range(2), VCC –0.3 4 V
Voltage Range at any input or output pin Differential voltage between positive and negative inputs –2.5 2.5 V
Voltage at differential inputs –0.5 VCC + 0.5 V
CMOS Inputs –0.5 VCC + 0.5 V
Maximum junction temperature, TJ 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND terminals.
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