ZHCSGV3G June   2009  – January 2017 TMS320C6748

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 DSP Subsystem
      1. 3.3.1 C674x DSP CPU Description
      2. 3.3.2 DSP Memory Mapping
        1. 3.3.2.1 External Memories
        2. 3.3.2.2 DSP Internal Memories
        3. 3.3.2.3 C674x CPU
    4. 3.4 Memory Map Summary
      1. Table 3-4 C6748 Top Level Memory Map
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Pin Multiplexing Control
    7. 3.7 Terminal Functions
      1. 3.7.1  Device Reset, NMI and JTAG
      2. 3.7.2  High-Frequency Oscillator and PLL
      3. 3.7.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.7.4  DEEPSLEEP Power Control
      5. 3.7.5  External Memory Interface A (EMIFA)
      6. 3.7.6  DDR2/mDDR Controller
      7. 3.7.7  Serial Peripheral Interface Modules (SPI)
      8. 3.7.8  Programmable Real-Time Unit (PRU)
      9. 3.7.9  Enhanced Capture/Auxiliary PWM Modules (eCAP0)
      10. 3.7.10 Enhanced Pulse Width Modulators (eHRPWM)
      11. 3.7.11 Boot
      12. 3.7.12 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      13. 3.7.13 Inter-Integrated Circuit Modules(I2C0, I2C1)
      14. 3.7.14 Timers
      15. 3.7.15 Multichannel Audio Serial Ports (McASP)
      16. 3.7.16 Multichannel Buffered Serial Ports (McBSP)
      17. 3.7.17 Universal Serial Bus Modules (USB0, USB1)
      18. 3.7.18 Ethernet Media Access Controller (EMAC)
      19. 3.7.19 Multimedia Card/Secure Digital (MMC/SD)
      20. 3.7.20 Liquid Crystal Display Controller(LCD)
      21. 3.7.21 Serial ATA Controller (SATA)
      22. 3.7.22 Universal Host-Port Interface (UHPI)
      23. 3.7.23 Universal Parallel Port (uPP)
      24. 3.7.24 Video Port Interface (VPIF)
      25. 3.7.25 General Purpose Input Output
      26. 3.7.26 Reserved and No Connect
      27. 3.7.27 Supply and Ground
    8. 3.8 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 DSP Interrupts
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Power Domain States
        2. 6.8.1.2 Module States
    9. 6.9  Enhanced Direct Memory Access Controller (EDMA3)
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA3 Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 EMIFA Connection Examples
      5. 6.10.5 External Memory Interface Register Descriptions
      6. 6.10.6 EMIFA Electrical Data/Timing
        1. Table 6-19 Timing Requirements for EMIFA SDRAM Interface
        2. Table 6-20 Switching Characteristics for EMIFA SDRAM Interface
        3. Table 6-21 Timing Requirements for EMIFA Asynchronous Memory Interface
    11. 6.11 DDR2/mDDR Memory Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Memory Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 DDR2/mDDR Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD0, MMCSD1)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
        1. Table 6-40 Timing Requirements for MMC/SD (see and )
        2. Table 6-41 Switching Characteristics for MMC/SD (see through )
    14. 6.14 Serial ATA Controller (SATA)
      1. 6.14.1 SATA Register Descriptions
      2. 6.14.2 1. SATA Interface
        1. 6.14.2.1 SATA Interface Schematic
        2. 6.14.2.2 Compatible SATA Components and Modes
        3. 6.14.2.3 PCB Stackup Specifications
        4. 6.14.2.4 Routing Specifications
        5. 6.14.2.5 Coupling Capacitors
        6. 6.14.2.6 SATA Interface Clock Source requirements
      3. 6.14.3 SATA Unused Signal Configuration
    15. 6.15 Multichannel Audio Serial Port (McASP)
      1. 6.15.1 McASP Peripheral Registers Description(s)
      2. 6.15.2 McASP Electrical Data/Timing
        1. 6.15.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-52 Timing Requirements for McASP0 (1.3V, 1.2V, 1.1V)
          2. Table 6-53 Timing Requirements for McASP0 (1.0V)
          3. Table 6-54 Switching Characteristics for McASP0 (1.3V, 1.2V, 1.1V)
          4. Table 6-55 Switching Characteristics for McASP0 (1.0V)
    16. 6.16 Multichannel Buffered Serial Port (McBSP)
      1. 6.16.1 McBSP Peripheral Register Description(s)
      2. 6.16.2 McBSP Electrical Data/Timing
        1. 6.16.2.1 Multichannel Buffered Serial Port (McBSP) Timing
          1. Table 6-57 Timing Requirements for McBSP0 [1.3V, 1.2V, 1.1V] (see )
          2. Table 6-58 Timing Requirements for McBSP0 [1.0V] (see )
          3. Table 6-59 Switching Characteristics for McBSP0 [1.3V, 1.2V, 1.1V] (see )
          4. Table 6-60 Switching Characteristics for McBSP0 [1.0V] (see )
          5. Table 6-61 Timing Requirements for McBSP1 [1.3V, 1.2V, 1.1V] (see )
          6. Table 6-62 Timing Requirements for McBSP1 [1.0V] (see )
          7. Table 6-63 Switching Characteristics for McBSP1 [1.3V, 1.2V, 1.1V] (see )
          8. Table 6-64 Switching Characteristics for McBSP1 [1.0V] (see )
          9. Table 6-65 Timing Requirements for McBSP0 FSR When GSYNC = 1 (see )
          10. Table 6-66 Timing Requirements for McBSP1 FSR When GSYNC = 1 (see )
    17. 6.17 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.17.1 SPI Peripheral Registers Description(s)
      2. 6.17.2 SPI Electrical Data/Timing
        1. 6.17.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-68 General Timing Requirements for SPI0 Master Modes
          2. Table 6-69 General Timing Requirements for SPI0 Slave Modes
          3. Table 6-76 General Timing Requirements for SPI1 Master Modes
          4. Table 6-77 General Timing Requirements for SPI1 Slave Modes
          5. Table 6-78 Additional SPI1 Master Timings, 4-Pin Enable Option
          6. Table 6-79 Additional SPI1 Master Timings, 4-Pin Chip Select Option
    18. 6.18 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.18.1 I2C Device-Specific Information
      2. 6.18.2 I2C Peripheral Registers Description(s)
      3. 6.18.3 I2C Electrical Data/Timing
        1. 6.18.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-85 Timing Requirements for I2C Input
          2. Table 6-86 Switching Characteristics for I2C
    19. 6.19 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.19.1 UART Peripheral Registers Description(s)
      2. 6.19.2 UART Electrical Data/Timing
        1. Table 6-88 Timing Requirements for UART Receive (see )
        2. Table 6-89 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    20. 6.20 Universal Serial Bus OTG Controller (USB0) [USB2.0 OTG]
      1. 6.20.1 USB0 [USB2.0] Electrical Data/Timing
        1. Table 6-91 Switching Characteristics Over Recommended Operating Conditions for USB0 [USB2.0] (see )
    21. 6.21 Universal Serial Bus Host Controller (USB1) [USB1.1 OHCI]
      1. Table 6-93 Switching Characteristics Over Recommended Operating Conditions for USB1 [USB1.1]
    22. 6.22 Ethernet Media Access Controller (EMAC)
      1. 6.22.1 EMAC Peripheral Register Description(s)
        1. 6.22.1.1 EMAC Electrical Data/Timing
          1. Table 6-98   Timing Requirements for MII_RXCLK (see )
          2. Table 6-99   Timing Requirements for MII_TXCLK (see )
          3. Table 6-100 Timing Requirements for EMAC MII Receive 10/100 Mbit/s (see )
          4. Table 6-101 Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit 10/100 Mbit/s (see )
    23. 6.23 Management Data Input/Output (MDIO)
      1. 6.23.1 MDIO Register Description(s)
      2. 6.23.2 Management Data Input/Output (MDIO) Electrical Data/Timing
        1. Table 6-105 Timing Requirements for MDIO Input (see and )
        2. Table 6-106 Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see )
    24. 6.24 LCD Controller (LCDC)
      1. 6.24.1 LCD Interface Display Driver (LIDD Mode)
      2. 6.24.2 LCD Raster Mode
        1. Table 6-110 Switching Characteristics Over Recommended Operating Conditions for LCD Raster Mode
    25. 6.25 Host-Port Interface (UHPI)
      1. 6.25.1 HPI Device-Specific Information
      2. 6.25.2 HPI Peripheral Register Description(s)
      3. 6.25.3 HPI Electrical Data/Timing
        1. Table 6-112 Timing Requirements for Host-Port Interface [1.2V, 1.1V]
        2. Table 6-113 Switching Characteristics Over Recommended Operating Conditions for Host-Port Interface [1.3V, 1.2V, 1.1V]
        3. Table 6-114 Switching Characteristics Over Recommended Operating Conditions for Host-Port Interface [1.0V]
    26. 6.26 Universal Parallel Port (uPP)
      1. 6.26.1 uPP Register Descriptions
        1. Table 6-115 Universal Parallel Port (uPP) Registers
      2. 6.26.2 uPP Electrical Data/Timing
        1. Table 6-116 Timing Requirements for uPP (see , , , )
        2. Table 6-117 Switching Characteristics Over Recommended Operating Conditions for uPP
    27. 6.27 Video Port Interface (VPIF)
      1. 6.27.1 VPIF Register Descriptions
        1. Table 6-118 Video Port Interface (VPIF) Registers
      2. 6.27.2 VPIF Electrical Data/Timing
        1. Table 6-119 Timing Requirements for VPIF VP_CLKINx Inputs (see )
        2. Table 6-120 Timing Requirements for VPIF Channels 0/1 Video Capture Data and Control Inputs (see )
        3. Table 6-121 Switching Characteristics Over Recommended Operating Conditions for Video Data Shown With Respect to VP_CLKOUT2/3 (see )
    28. 6.28 Enhanced Capture (eCAP) Peripheral
      1. Table 6-123 Timing Requirements for Enhanced Capture (eCAP)
      2. Table 6-124 Switching Characteristics Over Recommended Operating Conditions for eCAP
    29. 6.29 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 6.29.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-126 Timing Requirements for eHRPWM
        2. Table 6-127 Switching Characteristics Over Recommended Operating Conditions for eHRPWM
      2. 6.29.2 Trip-Zone Input Timing
    30. 6.30 Timers
      1. 6.30.1 Timer Electrical Data/Timing
        1. Table 6-130 Timing Requirements for Timer Input (see )
        2. Table 6-131 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    31. 6.31 Real Time Clock (RTC)
      1. 6.31.1 Clock Source
      2. 6.31.2 Real-Time Clock Register Descriptions
    32. 6.32 General-Purpose Input/Output (GPIO)
      1. 6.32.1 GPIO Register Description(s)
      2. 6.32.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-134 Timing Requirements for GPIO Inputs (see )
        2. Table 6-135 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.32.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-136 Timing Requirements for External Interrupts (see )
    33. 6.33 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.33.1 PRUSS Register Descriptions
    34. 6.34 Emulation Logic
      1. 6.34.1 JTAG Port Description
      2. 6.34.2 Scan Chain Configuration Parameters
      3. 6.34.3 Initial Scan Chain Configuration
      4. 6.34.4 IEEE 1149.1 JTAG
        1. 6.34.4.1 JTAG Peripheral Register Description(s) – JTAG ID Register (DEVIDR0)
        2. 6.34.4.2 JTAG Test-Port Electrical Data/Timing
          1. Table 6-147 Timing Requirements for JTAG Test Port (see )
          2. Table 6-148 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
      5. 6.34.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
    3. 7.3 Documentation Support
    4. 7.4 社区资源
    5. 7.5 商标
    6. 7.6 静电放电警告
    7. 7.7 出口管制提示
    8. 7.8 术语表
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZCE Package
    2. 8.2 Thermal Data for ZWT Package
    3. 8.3 Packaging Information

Table 6-69 General Timing Requirements for SPI0 Slave Modes(1)

NO. 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
9 tc(SPC)S Cycle Time, SPI0_CLK, All Slave Modes 40(2) 50(2) 60(2) ns
10 tw(SPCH)S Pulse Width High, SPI0_CLK, All Slave Modes 18 22 27 ns
11 tw(SPCL)S Pulse Width Low, SPI0_CLK, All Slave Modes 18 22 27 ns
12 tsu(SOMI_SPC)S Setup time, transmit data written to SPI before initial clock edge from
master.(3)(4) 		Polarity = 0, Phase = 0,
to SPI0_CLK rising		 2P 2P 2P ns
Polarity = 0, Phase = 1,
to SPI0_CLK rising		 2P 2P 2P
Polarity = 1, Phase = 0,
to SPI0_CLK falling		 2P 2P 2P
Polarity = 1, Phase = 1,
to SPI0_CLK falling		 2P 2P 2P
13 td(SPC_SOMI)S Delay, subsequent bits valid on SPI0_SOMI after transmit edge of SPI0_CLK Polarity = 0, Phase = 0,
from SPI0_CLK rising		 17 20 27 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 17 20 27
Polarity = 1, Phase = 0,
from SPI0_CLK falling		 17 20 27
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 17 20 27
14 toh(SPC_SOMI)S Output hold time, SPI0_SOMI valid after receive edge of SPI0_CLK Polarity = 0, Phase = 0,
from SPI0_CLK falling		 0.5S-6 0.5S-16 0.5S-20 ns
Polarity = 0, Phase = 1,
from SPI0_CLK rising		 0.5S-6 0.5S-16 0.5S-20
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 0.5S-6 0.5S-16 0.5S-20
Polarity = 1, Phase = 1,
from SPI0_CLK falling		 0.5S-6 0.5S-16 0.5S-20
15 tsu(SIMO_SPC)S Input Setup Time, SPI0_SIMO valid before receive edge of SPI0_CLK Polarity = 0, Phase = 0,
to SPI0_CLK falling		 1.5 1.5 1.5 ns
Polarity = 0, Phase = 1,
to SPI0_CLK rising		 1.5 1.5 1.5
Polarity = 1, Phase = 0,
to SPI0_CLK rising		 1.5 1.5 1.5
Polarity = 1, Phase = 1,
to SPI0_CLK falling		 1.5 1.5 1.5
16 tih(SPC_SIMO)S Input Hold Time, SPI0_SIMO valid after receive edge of SPI0_CLK Polarity = 0, Phase = 0,
from SPI0_CLK falling		 4 4 5 ns
Polarity = 0, Phase = 1,
from SPI0_CLK rising		 4 4 5
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 4 4 5
Polarity = 1, Phase = 1,
from SPI0_CLK falling		 4 4 5
(1) P = SYSCLK2 period; S = tc(SPC)S (SPI slave bit clock period)
(2) This timing is limited by the timing shown or 3P, whichever is greater.
(3) First bit may be MSB or LSB depending upon SPI configuration. SO(0) refers to first bit and SO(n) refers to last bit output on SPI0_SOMI. SI(0) refers to the first bit input and SI(n) refers to the last bit input on SPI0_SIMO.
(4) Measured from the termination of the write of new data to the SPI module, In analyzing throughput requirements, additional internal bus cycles must be accounted for to allow data to be written to the SPI module by the CPU.

Table 6-70 Additional SPI0 Master Timings, 4-Pin Enable Option (5)(1)(2)

NO. PARAMETER 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
17 td(ENA_SPC)M Delay from slave assertion of SPI0_ENA active to first SPI0_CLK from master.(3) Polarity = 0, Phase = 0,
to SPI0_CLK rising		 3P+5 3P+5 3P+6 ns
Polarity = 0, Phase = 1,
to SPI0_CLK rising		 0.5M+3P+5 0.5M+3P+5 0.5M+3P+6
Polarity = 1, Phase = 0,
to SPI0_CLK falling		 3P+5 3P+5 3P+6
Polarity = 1, Phase = 1,
to SPI0_CLK falling		 0.5M+3P+5 0.5M+3P+5 0.5M+3P+6
18 td(SPC_ENA)M Max delay for slave to deassert SPI0_ENA after final SPI0_CLK edge to ensure master does not begin the next transfer.(4) Polarity = 0, Phase = 0,
from SPI0_CLK falling		 0.5M+P+5 0.5M+P+5 0.5M+P+6 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 P+5 P+5 P+6
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 0.5M+P+5 0.5M+P+5 0.5M+P+6
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 P+5 P+5 P+6
(1) P = SYSCLK2 period; M = tc(SPC)M (SPI master bit clock period)
(2) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.
(3) In the case where the master SPI is ready with new data before SPI0_ENA assertion.
(4) In the case where the master SPI is ready with new data before SPI0_EN A deassertion.
(5) These parameters are in addition to the general timings for SPI master modes (Table 6-68).

Table 6-71 Additional SPI0 Master Timings, 4-Pin Chip Select Option (7)(1)(2)

NO. PARAMETER 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
19 td(SCS_SPC)M Delay from SPI0_SCS active to first SPI0_CLK(3)(4) Polarity = 0, Phase = 0,
to SPI0_CLK rising		 2P-1 2P-2 2P-3 ns
Polarity = 0, Phase = 1,
to SPI0_CLK rising		 0.5M+2P-1 0.5M+2P-2 0.5M+2P-3
Polarity = 1, Phase = 0,
to SPI0_CLK falling		 2P-1 2P-2 2P-3
Polarity = 1, Phase = 1,
to SPI0_CLK falling		 0.5M+2P-1 0.5M+2P-2 0.5M+2P-3
20 td(SPC_SCS)M Delay from final SPI0_CLK edge to master deasserting SPI0_SCS(5)(6) Polarity = 0, Phase = 0,
from SPI0_CLK falling		 0.5M+P-1 0.5M+P-2 0.5M+P-3 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 P-1 P-2 P-3
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 0.5M+P-1 0.5M+P-2 0.5M+P-3
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 P-1 P-2 P-3
(1) P = SYSCLK2 period; M = tc(SPC)M (SPI master bit clock period)
(2) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.
(3) In the case where the master SPI is ready with new data before SPI0_SCS assertion.
(4) This delay can be increased under software control by the register bit field SPIDELAY.C2TDELAY[4:0].
(5) Except for modes when SPIDAT1.CSHOLD is enabled and there is additional data to transmit. In this case, SPI0_SCS will remain asserted.
(6) This delay can be increased under software control by the register bit field SPIDELAY.T2CDELAY[4:0].
(7) These parameters are in addition to the general timings for SPI master modes (Table 6-68).

Table 6-72 Additional SPI0 Master Timings, 5-Pin Option (10)(1)(2)

NO. PARAMETER 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
18 td(SPC_ENA)M Max delay for slave to deassert SPI0_ENA after final SPI0_CLK edge to ensure master does not begin the next transfer.(3) Polarity = 0, Phase = 0,
from SPI0_CLK falling		 0.5M+P+5 0.5M+P+5 0.5M+P+6 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 P+5 P+5 P+6
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 0.5M+P+5 0.5M+P+5 0.5M+P+6
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 P+5 P+5 P+6
20 td(SPC_SCS)M Delay from final SPI0_CLK edge to
master deasserting SPI0_SCS(4)(5) 		Polarity = 0, Phase = 0,
from SPI0_CLK falling		 0.5M+P-2 0.5M+P-2 0.5M+P-3 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 P-2 P-2 P-3
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 0.5M+P-2 0.5M+P-2 0.5M+P-3
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 P-2 P-2 P-3
21 td(SCSL_ENAL)M Max delay for slave SPI to drive SPI0_ENA valid after master asserts SPI0_SCS to delay the master from beginning the next transfer, C2TDELAY+P C2TDELAY+P C2TDELAY+P ns
22 td(SCS_SPC)M Delay from SPI0_SCS active to first SPI0_CLK(6)(7)(8) Polarity = 0, Phase = 0,
to SPI0_CLK rising		 2P-2 2P-2 2P-3 ns
Polarity = 0, Phase = 1,
to SPI0_CLK rising		 0.5M+2P-2 0.5M+2P-2 0.5M+2P-3
Polarity = 1, Phase = 0,
to SPI0_CLK falling		 2P-2 2P-2 2P-3
Polarity = 1, Phase = 1,
to SPI0_CLK falling		 0.5M+2P-2 0.5M+2P-2 0.5M+2P-3
23 td(ENA_SPC)M Delay from assertion of SPI0_ENA low to first SPI0_CLK edge.(9) Polarity = 0, Phase = 0,
to SPI0_CLK rising		 3P+5 3P+5 3P+6 ns
Polarity = 0, Phase = 1,
to SPI0_CLK rising		 0.5M+3P+5 0.5M+3P+5 0.5M+3P+6
Polarity = 1, Phase = 0,
to SPI0_CLK falling		 3P+5 3P+5 3P+6
Polarity = 1, Phase = 1,
to SPI0_CLK falling		 0.5M+3P+5 0.5M+3P+5 0.5M+3P+6
(1) P = SYSCLK2 period; M = tc(SPC)M (SPI master bit clock period)
(2) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.
(3) In the case where the master SPI is ready with new data before SPI0_ENA deassertion.
(4) Except for modes when SPIDAT1.CSHOLD is enabled and there is additional data to transmit. In this case, SPI0_SCS will remain asserted.
(5) This delay can be increased under software control by the register bit field SPIDELAY.T2CDELAY[4:0].
(6) If SPI0_ENA is asserted immediately such that the transmission is not delayed by SPI0_ENA.
(7) In the case where the master SPI is ready with new data before SPI0_SCS assertion.
(8) This delay can be increased under software control by the register bit field SPIDELAY.C2TDELAY[4:0].
(9) If SPI0_ENA was initially deasserted high and SPI0_CLK is delayed.
(10) These parameters are in addition to the general timings for SPI master modes (Table 6-69).

Table 6-73 Additional SPI0 Slave Timings, 4-Pin Enable Option (3)(1)(2)

NO. PARAMETER 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
24 td(SPC_ENAH)S Delay from final SPI0_CLK edge to slave deasserting SPI0_ENA. Polarity = 0, Phase = 0,
from SPI0_CLK falling		 1.5P-3 2.5P+17.5 1.5P-3 2.5P+20 1.5P-3 2.5P+27 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 – 0.5M+1.5P-3 – 0.5M+2.5P+17.5 – 0.5M+1.5P-3 – 0.5M+2.5P+20 – 0.5M+1.5P-3 – 0.5M+2.5P+27
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 1.5P-3 2.5P+17.5 1.5P-3 2.5P+20 1.5P-3 2.5P+27
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 – 0.5M+1.5P-3 – 0.5+2.5P+17.5 – 0.5M+1.5P-3 – 0.5+2.5P+20 – 0.5M+1.5P-3 – 0.5+2.5P+27
(1) P = SYSCLK2 period; M = tc(SPC)M (SPI master bit clock period)
(2) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.
(3) These parameters are in addition to the general timings for SPI slave modes (Table 6-69).

Table 6-74 Additional SPI0 Slave Timings, 4-Pin Chip Select Option (3)(1)(2)

NO. PARAMETER 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
25 td(SCSL_SPC)S Required delay from SPI0_SCS asserted at slave to first SPI0_CLK edge at slave. P + 1.5 P + 1.5 P + 1.5 ns
26 td(SPC_SCSH)S Required delay from final SPI0_CLK edge before SPI0_SCS is deasserted. Polarity = 0, Phase = 0,
from SPI0_CLK falling		 0.5M+P+4 0.5M+P+4 0.5M+P+5 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 P+4 P+4 P+5
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 0.5M+P+4 0.5M+P+4 0.5M+P+5
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 P+4 P+4 P+5
27 tena(SCSL_SOMI)S Delay from master asserting SPI0_SCS to slave driving SPI0_SOMI valid P+17.5 P+20 P+27 ns
28 tdis(SCSH_SOMI)S Delay from master deasserting SPI0_SCS to slave 3-stating SPI0_SOMI P+17.5 P+20 P+27 ns
(1) P = SYSCLK2 period; M = tc(SPC)M (SPI master bit clock period)
(2) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.
(3) These parameters are in addition to the general timings for SPI slave modes (Table 6-69).

Table 6-75 Additional SPI0 Slave Timings, 5-Pin Option (4)(1)(2)

NO. PARAMETER 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
25 td(SCSL_SPC)S Required delay from SPI0_SCS asserted at slave to first SPI0_CLK edge at slave. P + 1.5 P + 1.5 P + 1.5 ns
26 td(SPC_SCSH)S Required delay from final SPI0_CLK edge before SPI0_SCS is deasserted. Polarity = 0, Phase = 0,
from SPI0_CLK falling		 0.5M+P+4 0.5M+P+4 0.5M+P+5 ns
Polarity = 0, Phase = 1,
from SPI0_CLK falling		 P+4 P+4 P+5
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 0.5M+P+4 0.5M+P+4 0.5M+P+5
Polarity = 1, Phase = 1,
from SPI0_CLK rising		 P+4 P+4 P+5
27 tena(SCSL_SOMI)S Delay from master asserting SPI0_SCS to slave driving SPI0_SOMI valid P+17.5 P+20 P+27 ns
28 tdis(SCSH_SOMI)S Delay from master deasserting SPI0_SCS to slave 3-stating SPI0_SOMI P+17.5 P+20 P+27 ns
29 tena(SCSL_ENA)S Delay from master deasserting SPI0_SCS to slave driving SPI0_ENA valid 17.5 20 27 ns
30 tdis(SPC_ENA)S Delay from final clock receive edge on SPI0_CLK to slave 3-stating or driving high SPI0_ENA.(3) Polarity = 0, Phase = 0,
from SPI0_CLK falling		 2.5P+17.5 2.5P+20 2.5P+27 ns
Polarity = 0, Phase = 1,
from SPI0_CLK rising		 2.5P+17.5 2.5P+20 2.5P+27
Polarity = 1, Phase = 0,
from SPI0_CLK rising		 2.5P+17.5 2.5P+20 2.5P+27
Polarity = 1, Phase = 1,
from SPI0_CLK falling		 2.5P+17.5 2.5P+20 2.5P+27
(1) P = SYSCLK2 period; M = tc(SPC)M (SPI master bit clock period)
(2) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.
(3) SPI0_ENA is driven low after the transmission completes if the SPIINT0.ENABLE_HIGHZ bit is programmed to 0. Otherwise it is tri-stated. If tri-stated, an external pullup resistor should be used to provide a valid level to the master. This option is useful when tying several SPI slave devices to a single master.
(4) These parameters are in addition to the general timings for SPI slave modes (Table 6-69).
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