ZHCSGY7B October   2017  – January 2018 TPS92830-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Bias
        1. 8.3.1.1 Power-On-Reset (POR)
        2. 8.3.1.2 Current Reference (IREF)
        3. 8.3.1.3 Low-Current Fault Mode
      2. 8.3.2 Charge Pump
        1. 8.3.2.1 Charge Pump Architecture
      3. 8.3.3 Constant-Current Driving
        1. 8.3.3.1 High-Side Current Sense
        2. 8.3.3.2 High-Side Current Driving
        3. 8.3.3.3 Gate Overdrive Voltage Protection
        4. 8.3.3.4 High-Precision Current Regulation
        5. 8.3.3.5 Parallel MOSFET Driving
      4. 8.3.4 PWM Dimming
        1. 8.3.4.1 Supply Dimming
        2. 8.3.4.2 PWM Dimming by Input
        3. 8.3.4.3 Internal Precision PWM Generator
        4. 8.3.4.4 Full Duty-Cycle Switch
      5. 8.3.5 Analog Dimming
        1. 8.3.5.1 Analog Dimming Topology
        2. 8.3.5.2 Internal High-Precision Pullup Current Source
      6. 8.3.6 Output Current Derating
        1. 8.3.6.1 Output-Current Derating Topology
      7. 8.3.7 Diagnostics and Fault
        1. 8.3.7.1 LED Short-to-GND Detection
        2. 8.3.7.2 LED Short-to-GND Auto Retry
        3. 8.3.7.3 LED Open-Circuit Detection
        4. 8.3.7.4 LED Open-Circuit Auto Retry
        5. 8.3.7.5 Dropout-Mode Diagnostics
        6. 8.3.7.6 Overtemperature Protection
        7. 8.3.7.7 FAULT Bus Output With One-Fails–All-Fail
        8. 8.3.7.8 Fault Table
    4. 8.4 Device Functional Modes
      1. 8.4.1 Undervoltage Lockout, V(IN) < V(UVLO)
      2. 8.4.2 Normal Operation (V(IN) ≥ 4.5 V, V(IN) > V(LED) + 0.5 V)
      3. 8.4.3 Low-Voltage Dropout
      4. 8.4.4 Fault Mode (Fault Is Detected)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application for Automotive Exterior Lighting With One-Fails–All-Fail
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 High-Precision Dual-Brightness PWM Generation
        1. 9.2.2.1 Dual-Brightness Application
        2. 9.2.2.2 Design Requirements
        3. 9.2.2.3 Detailed Design Procedure
        4. 9.2.2.4 Application Curve
      3. 9.2.3 Driving High-Current LEDs With Parallel MOSFETs
        1. 9.2.3.1 Application Curves
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

8.3.3.2 High-Side Current Driving

To regulate the output current, the gate-source voltage of the external MOSFET must be regulated accordingly. The constant-current source is used to charge and discharge the N-channel MOSFET gate. During the current-slewing period, constant-current sourcing and sinking ensures the smooth slewing of the output current. The control loop requires sufficient MOSFET gate capacitance to ensure loop stability. In case the MOSFET gate capacitance is insufficient, a capacitor CGS must be added across Gx and SENSEx. TI also recommends always putting a CSENSE of 10 nF from each of the SENSEx pins to GND, and close to the device for EMC.

When a channel is switched on, current source I(DRV_source) charges the gate of the external N-channel MOSFET. When a channel is switched off, current sink I(DRV_sink) discharges the gate of the external MOSFET transistor down to ground.

TPS92830-Q1 Highside_MOSFET_with_Capacitor_SLIS178.gifFigure 21. MOSFET Gate Capacitance Compensation
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