ZHCSH16C November   2017  – August 2019 TPS25820 , TPS25821

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 USB Type C Basic
      2. 7.1.2 Configuration Channel
      3. 7.1.3 Detecting a Connection
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Configuration Channel Pins CC1 and CC2
      2. 7.3.2 Current Capability Advertisement and VBUS Overload Protection
      3. 7.3.3 FAULT Response
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 REF
      6. 7.3.6 Plug Polarity Detection
      7. 7.3.7 Sink Attachment Indicator
      8. 7.3.8 Device Enable Control
      9. 7.3.9 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Type-C Source Port Implementation without BC 1.2 Support
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input and Output Capacitance Considerations
          2. 8.2.1.1.2 System Level ESD Protection
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Type -C Source Port Implementation with BC 1.2 (DCP Mode) Support
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Implementing a USB 3.1 Type-C Charging Port with the TPS25820
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 Implementing TPS25821 in USB Car Chargers
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 相关链接
    4. 11.4 接收文档更新通知
    5. 11.5 社区资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

Detailed Design Procedure

Design considerations are listed below:

  • Place at least 120 µF of bypass capacitance close to the IN pins versus OUT as Type C is a cold socket connector.
  • A <10-µF bypass capacitor is recommended placed near Type-C receptacle VBUS pin to handle load transients.
  • Depending on the max current level advertisement supported by the Type-C port in the system, set CHG levels accordingly.
  • EN and CHG pins can be tied directly to GND or IN without a pull-up resistor.
    • CHG can also be dynamically controlled by a µC to change the current advertisement level to the sink.
  • When an open drain output of the TPS25820 is not used, it can be left as NC or tied to GND or when used, pulled up to IN supply via a 100-kΩ resistor.
  • Connect a 0.5% 100-kΩ resistor between the REF and GND pins placing it close to the device pin and isolated from switching noise on the board.