ZHCSH26E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3120MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary
    5. 8.5  TX Power and IBAT versus TX Power Level Settings
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  Electrical Characteristics
    8. 8.8  WLAN Receiver Characteristics
    9. 8.9  WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Power-Up Sequencing
      2. 8.12.2 Power-Down Sequencing
      3. 8.12.3 Device Reset
      4. 8.12.4 Wakeup From HIBERNATE Mode Timing
    13. 8.13 External Interfaces
      1. 8.13.1 SPI Host Interface
      2. 8.13.2 Host UART Interface
        1. 8.13.2.1 5-Wire UART Topology
        2. 8.13.2.2 4-Wire UART Topology
        3. 8.13.2.3 3-Wire UART Topology
      3. 8.13.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Restoring Factory Default Configuration
    6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
    7. 9.7 Module Markings
    8. 9.8 End Product Labeling
    9. 9.9 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 10.1.3 Reset
      4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

12.4 Documentation Support

To receive notification of documentation updates — including silicon errata — go to the CC3120MOD product folder on ti.com, and click the Alert me button in the upper-right corner. This registers you to receive a weekly digest of updated product information (if any). For change details, check the revision history of any revised document. The current documentation which describes the processor, related peripherals, and other technical collateral follows. The following documents provide support for the CC3120MOD module.

Application Reports

    SimpleLink™ CC3x20 Wi-Fi® Internet-on-a chip™ Solution Built-In Security FeaturesThe SimpleLink Wi-Fi CC3120 and CC3220 Internet-on-a chip family of devices from Texas Instruments offers a wide range of built-in security features to help developers address a variety of security needs, which is achieved without any processing burden on the main MCU. This document describes these security-related features and provides recommendations for leveraging each feature in the context of practical system implementation.
    Using Serial Flash on SimpleLink™ CC3x20 Wi-Fi® and Internet-of-Things DevicesThis application note is divided into two parts. The first part provides important guidelines and best practice design techniques to consider when choosing and embedding a serial flash paired with the CC3120 and CC3220 (CC3x20) devices. The second part describes the file system, along with guidelines and considerations for system designers working with the CC3x20 devices.

User's Guides

    SimpleLink™ CC3x20 Wi-Fi® Embedded ProgrammingThis application note describes in detail additional options that leverage all the features UniFlash has to offer, but without the necessary connected PC. This option is referred to as Embedded Programming. To achieve embedded programming, bootloader protocol implemented over UART is described in detail.
    SimpleLink™ CC3x20 Wi-Fi® and Internet-of-Things Network ProcessorThis document provides software (SW) programmers with all of the required knowledge for working with the networking subsystem of the SimpleLink Wi-Fi devices. This guide provides basic guidelines for writing robust, optimized networking host applications, and describes the capabilities of the networking subsystem. The guide contains some example code snapshots, to give users an idea of how to work with the host driver. More comprehensive code examples can be found in the formal software development kit (SDK). This guide does not provide a detailed description of the host driver APIs.
    SimpleLink™ CC3x20 Wi-Fi® Provisioning for Mobile ApplicationsThis guide describes TI’s SimpleLink™ Wi-Fi® provisioning solution for mobile applications, specifically on the usage of the Android™ and iOS® building blocks for UI requirements, networking, and provisioning APIs required for building the mobile application.
    SimpleLink™ CC3120 Wi-Fi® Internet-on-a chip™ Solution SDKThis guide is intended to help users in the initial setup and demonstration of the different demos in the CC3120 SDK. The guide lists the software and hardware components required to get started, and explains how to install the supported integrated development environment (IDE), SimpleLink CC3120 SDK, and the various other tools required.
    SimpleLink™ CC3x20 Wi-Fi® and Internet-on-a chip™ Solution Radio ToolThe Radio Tool serves as a control panel for direct access to the radio, and can be used for both the radio frequency (RF) evaluation and for certification purposes. This guide describes how to have the tool work seamlessly on Texas Instruments ™ evaluation platforms such as the BoosterPack™ plus FTDI emulation board for CC3120 devices, and the LaunchPad™ for CC3220 devices.

More Literature

RemoTI Manifest

Design Files

SimpleLink™ CC3120MOD WI-Fi® and Internet of Things CC3120 Hardware

SimpleLink™ CC3x20 Wi-Fi® and Internet of Things
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