ZHCSH26E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3120MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary
    5. 8.5  TX Power and IBAT versus TX Power Level Settings
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  Electrical Characteristics
    8. 8.8  WLAN Receiver Characteristics
    9. 8.9  WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Power-Up Sequencing
      2. 8.12.2 Power-Down Sequencing
      3. 8.12.3 Device Reset
      4. 8.12.4 Wakeup From HIBERNATE Mode Timing
    13. 8.13 External Interfaces
      1. 8.13.1 SPI Host Interface
      2. 8.13.2 Host UART Interface
        1. 8.13.2.1 5-Wire UART Topology
        2. 8.13.2.2 4-Wire UART Topology
        3. 8.13.2.3 3-Wire UART Topology
      3. 8.13.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Restoring Factory Default Configuration
    6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
    7. 9.7 Module Markings
    8. 9.8 End Product Labeling
    9. 9.9 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 10.1.3 Reset
      4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

8.1 Absolute Maximum Ratings

These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term reliability of the module (1)(2).
MINMAXUNIT
VBAT–0.53.8V
Digital I/O–0.5VBAT + 0.5V
RF pin–0.52.1V
Analog pins–0.52.1V
Operating temperature, TA–4085°C
Storage temperature, Tstg–4085°C
Junction temperature, Tj(3)120°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) Junction temperature is for the CC3120RNMARGK device that is contained within the module.
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