ZHCSH26E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3120MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary
    5. 8.5  TX Power and IBAT versus TX Power Level Settings
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  Electrical Characteristics
    8. 8.8  WLAN Receiver Characteristics
    9. 8.9  WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Power-Up Sequencing
      2. 8.12.2 Power-Down Sequencing
      3. 8.12.3 Device Reset
      4. 8.12.4 Wakeup From HIBERNATE Mode Timing
    13. 8.13 External Interfaces
      1. 8.13.1 SPI Host Interface
      2. 8.13.2 Host UART Interface
        1. 8.13.2.1 5-Wire UART Topology
        2. 8.13.2.2 4-Wire UART Topology
        3. 8.13.2.3 3-Wire UART Topology
      3. 8.13.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Restoring Factory Default Configuration
    6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
    7. 9.7 Module Markings
    8. 9.8 End Product Labeling
    9. 9.9 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 10.1.3 Reset
      4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

9.5 Restoring Factory Default Configuration

The device has an internal recovery mechanism that allows rolling back the file system to its predefined factory image or restoring the factory default parameters of the device. The factory image is kept in a separate sector on the sFLASH in a secure manner and cannot be accessed from the host processor. The following restore modes are supported:

  • None—no factory restore settings
  • Enable restore of factory default parameters
  • Enable restore of factory image and factory default parameters

The restore process is performed by pulling or forcing SOP[2:0] = 110 pins and toggling the nRESET pin from low to high.

The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The restore process typically takes about 8 seconds, depending on the attributes of the serial Flash vendor.
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