ZHCSH62B December   2017  – October 2019 LM76002-Q1 , LM76003-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化原理图
    2.     效率与输出电流（VOUT = 5V，fSW = 400kHz，自动模式）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 System Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency, Peak-Current-Mode Control
      2. 7.3.2  Light Load Operation Modes — PFM and FPWM
      3. 7.3.3  Adjustable Output Voltage
      4. 7.3.4  Enable (EN Pin) and UVLO
      5. 7.3.5  Internal LDO, VCC UVLO, and Bias Input
      6. 7.3.6  Soft Start and Voltage Tracking (SS/TRK)
      7. 7.3.7  Adjustable Switching Frequency (RT) and Frequency Synchronization
      8. 7.3.8  Minimum On-Time, Minimum Off-Time, and Frequency Foldback at Dropout Conditions
      9. 7.3.9  Internal Compensation and CFF
      10. 7.3.10 Bootstrap Voltage and VBOOT UVLO (BOOT Pin)
      11. 7.3.11 Power Good and Overvoltage Protection (PGOOD)
      12. 7.3.12 Overcurrent and Short-Circuit Protection
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
      4. 7.4.4 CCM Mode
      5. 7.4.5 DCM Mode
      6. 7.4.6 Light Load Mode
      7. 7.4.7 Foldback Mode
      8. 7.4.8 Forced Pulse-Width-Modulation Mode
      9. 7.4.9 Self-Bias Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Output Voltage Setpoint
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Input Capacitors
        5. 8.2.2.5  Inductor Selection
        6. 8.2.2.6  Output Capacitor Selection
        7. 8.2.2.7  Feed-Forward Capacitor
        8. 8.2.2.8  Bootstrap Capacitors
        9. 8.2.2.9  VCC Capacitors
        10. 8.2.2.10 BIAS Capacitors
        11. 8.2.2.11 Soft-Start Capacitors
        12. 8.2.2.12 Undervoltage Lockout Setpoint
        13. 8.2.2.13 PGOOD
        14. 8.2.2.14 Synchronization
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Highlights
      2. 10.1.2 Compact Layout for EMI Reduction
      3. 10.1.3 Ground Plane and Thermal Considerations
      4. 10.1.4 Feedback Resistors
    2. 10.2 Layout Example
    3. 10.3 Thermal Design
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

6.4 Thermal Information

THERMAL METRIC(1) LM76002/LM76003 UNIT
RNP (WQFN)
30 PINS
RθJA Junction-to-ambient thermal resistance 29.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.6 °C/W
RθJB Junction-to-board thermal resistance 9.1 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 9.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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