ZHCSH63B October 2017 – January 2020 TLC6C5816-Q1
PRODUCTION DATA.
To enhance the thermal performance, the TLC6C5816-Q1 device is designed with a thermal pad. TI recommends to reserve enough copper area for a heat sink. To minimize the noise interference, it is recommended to put the filter capacitor near the VCC pin. For a detailed layout example, see the following example.