ZHCSHC1B January   2018  – January  2020 TPS92612-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     典型应用图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Bias
        1. 7.3.1.1 Power-On Reset (POR)
      2. 7.3.2 Constant-Current Driver
      3. 7.3.3 PWM Dimming
      4. 7.3.4 Protection
        1. 7.3.4.1 Short-to-GND Protection
        2. 7.3.4.2 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Undervoltage Lockout, V(SUPPLY)< V(POR_rising)
      2. 7.4.2 Normal Operation, V(SUPPLY) ≥ 4.5 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Single-Channel LED Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Channel LED Driver With Heat Sharing
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS92612-Q1 UNIT
DBV (SOT23)
5 PINS
RθJA Junction-to-ambient thermal resistance 200.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 104.4 °C/W
RθJB Junction-to-board thermal resistance 45.6 °C/W
ψJT Junction-to-top characterization parameter 17.5 °C/W
ψJB Junction-to-board characterization parameter 45.2 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
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