ZHCSHO1D
November 2018 – January 2019
LMG1210
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化的典型应用
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics
6.7
Typical Characteristics
6.8
Timing Diagrams
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Bootstrap Diode Operation
7.3.2
LDO Operation
7.3.3
Dead Time Selection
7.3.4
Overtemperature Protection
7.3.5
High-Performance Level Shifter
7.3.6
Negative HS Voltage Handling
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Bypass Capacitor
8.2.2.2
Bootstrap Diode Selection
8.2.2.3
Handling Ground Bounce
8.2.2.4
Independent Input Mode
8.2.2.5
Computing Power Dissipation
8.2.3
Application Curves
8.3
Do's and Don'ts
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
器件和文档支持
11.1
文档支持
11.1.1
相关文档
11.2
接收文档更新通知
11.3
社区资源
11.4
商标
11.5
静电放电警告
11.6
术语表
12
机械、封装和可订购信息
6.7
Typical Characteristics
Figure 1.
Peak Source Current vs Output Voltage
Figure 3.
IDD vs Frequency, Unloaded
Figure 5.
IDD vs Temperature
Figure 7.
Propagation Delay vs Temperature
Figure 9.
Propagation Delay Change vs Bootstrap voltage
Figure 11.
LO and HO Output Current vs Temperature
Figure 2.
Peak Sink Current vs Output Voltage
Figure 4.
I
HBO
vs Frequency, Unloaded
Figure 6.
IHB vs Temperature
Figure 8.
Minimum Dead Time vs Temperature
Figure 10.
Propagation Delay vs relative phase of CMTI Phase
Figure 12.
1 nF Loaded Rise and Fall Time vs Temperature
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