ZHCSI13J October 2004 – November 2018 TPS75003
PRODUCTION DATA.
- 1 特性
- 2 应用
- 3 说明
- 4 修订历史记录
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Operation (Buck Controllers)
- 7.3.2 Enable (Buck Controllers)
- 7.3.3 UVLO (Buck Controllers)
- 7.3.4 Current Limit (Buck Controllers)
- 7.3.5 Short-Circuit Protection (Buck Controllers)
- 7.3.6 Soft-Start (Buck Controllers)
- 7.3.7 LDO Operation
- 7.3.8 Internal Current Limit (LDO)
- 7.3.9 Enable Pin (LDO)
- 7.3.10 Dropout Voltage (LDO)
- 7.3.11 Transient Response (LDO)
- 7.3.12 Thermal Protection (LDO)
- 7.3.13 Power Dissipation (LDO)
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Input Capacitor CIN1, CIN2 Selection (Buck Controllers)
- 8.2.2.2 Inductor Value Selection (Buck Controllers)
- 8.2.2.3 External PMOS Transistor Selection (Buck Controllers)
- 8.2.2.4 Diode Selection (Buck Controllers)
- 8.2.2.5 Output Capacitor Selection (Buck Controllers)
- 8.2.2.6 Output Voltage Ripple Effect on VOUT (Buck Controllers)
- 8.2.2.7 Soft-Start Capacitor Selection (Buck Controllers)
- 8.2.2.8 Output Voltage Setting Selection (Buck Controllers)
- 8.2.2.9 Input Capacitor Selection (LDO)
- 8.2.2.10 Output Capacitor Selection (LDO)
- 8.2.2.11 Soft-Start Capacitor Selection (LDO)
- 8.2.2.12 Setting Output Voltage (LDO)
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文档支持
- 12机械、封装和可订购信息
7.3.13 Power Dissipation (LDO)
The TPS75003 device is available in a QFN-style package with an exposed lead frame on the package underside. The exposed lead frame is the primary path for removing heat and should be soldered to a PC board that is configured to remove the amount of power dissipated by the LDO regulator, as calculated by Equation 3.
Power dissipation can be minimized by using the lowest possible input voltage necessary to ensure the required output voltage. The two buck converters do not contribute a significant amount of dissipated power. Using heavier copper will increase the overall effectiveness of removing heat from the device. The addition of plated through-holes to heat-dissipating layers will also improve the heatsink effectiveness.