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ZHCSI18A April 2018 – July 2018 OPA858

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		OPA858	UNIT
		DSG (WSON)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	80.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	100	°C/W
R_θJB	Junction-to-board thermal resistance	45	°C/W
ψ_JT	Junction-to-top characterization parameter	6.8	°C/W
ψ_JB	Junction-to-board characterization parameter	45.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	22.7	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.