ZHCSI81L
February 2009 – May 2018
LM26420
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
LM26420 双路降压直流/直流转换器
LM26420 效率(高达 93%)
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions: 16-Pin WQFN
Pin Functions 20-Pin HTSSOP
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings (LM26420X/Y)
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics Per Buck
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Soft Start
7.3.2
Power Good
7.3.3
Precision Enable
7.4
Device Functional Modes
7.4.1
Output Overvoltage Protection
7.4.2
Undervoltage Lockout
7.4.3
Current Limit
7.4.4
Thermal Shutdown
8
Application and Implementation
8.1
Application Information
8.1.1
Programming Output Voltage
8.1.2
VINC Filtering Components
8.1.3
Using Precision Enable and Power Good
8.1.4
Overcurrent Protection
8.2
Typical Applications
8.2.1
LM26420X 2.2-MHz, 0.8-V Typical High-Efficiency Application Circuit
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.2.1
Custom Design With WEBENCH® Tools
8.2.1.2.2
Inductor Selection
8.2.1.2.3
Input Capacitor Selection
8.2.1.2.4
Output Capacitor
8.2.1.2.5
Calculating Efficiency and Junction Temperature
8.2.1.3
Application Curves
8.2.2
LM26420X 2.2-MHz, 1.8-V Typical High-Efficiency Application Circuit
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.3
Application Curves
8.2.3
LM26420X 2.2-MHz, 2.5-V Typical High-Efficiency Application Circuit
8.2.3.1
Design Requirements
8.2.3.2
Detailed Design Procedure
8.2.3.3
Application Curves
8.2.4
LM26420Y 550 kHz, 0.8-V Typical High-Efficiency Application Circuit
8.2.4.1
Design Requirements
8.2.4.2
Detailed Design Procedure
8.2.4.3
Application Curves
8.2.5
LM26420Y 550-kHz, 1.8-V Typical High-Efficiency Application Circuit
8.2.5.1
Design Requirements
8.2.5.2
Detailed Design Procedure
8.2.5.3
Application Curves
8.2.6
LM26420Y 550-kHz, 2.5-V Typical High-Efficiency Application Circuit
8.2.6.1
Design Requirements
8.2.6.2
Detailed Design Procedure
8.2.6.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.3
Thermal Considerations
10.3.1
Method 1: Silicon Junction Temperature Determination
10.3.2
Thermal Shutdown Temperature Determination
11
器件和文档支持
11.1
器件支持
11.1.1
第三方米6体育平台手机版_好二三四免责声明
11.1.2
使用 WEBENCH® 工具创建定制设计方案
11.2
文档支持
11.2.1
相关文档
11.3
接收文档更新通知
11.4
社区资源
11.5
商标
11.6
静电放电警告
11.7
术语表
12
机械、封装和可订购信息
8.2.1.2
Detailed Design Procedure
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