ZHCSIF6D March   2008  – November 2023 UCC27324-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Overall Electrical Characteristics
    6. 5.6  Power Dissipation Characteristics
    7. 5.7  Input (INA, INB) Electrical Characteristics
    8. 5.8  Output (OUTA, OUTB) Electrical Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stage
      2. 6.3.2 Output Stage
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Parallel Outputs
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Propagation Delay
        2. 7.2.2.2 Source and Sink Capabilities During Miller Plateau
        3. 7.2.2.3 Supply Voltage (VDD)
        4. 7.2.2.4 Drive Current and Power Requirements
      3. 7.2.3 Application Curve
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

说明

UCC27324-Q1 高速双路 MOSFET 驱动器可向容性负载提供大峰值电流。通过使用本身能够最大限度减少击穿电流的设计,这些驱动器可在 MOSFET 开关切换期间,在米勒平坦区域提供最需要的 4A 电流。独特的双极和 MOSFET 混合输出级并联,可在低电源电压下实现高效的拉电流和灌电流。

该器件采用标准的 SOIC-8 (D) 封装。

器件信息
器件型号封装(1)封装尺寸(标称值)
UCC27324-Q1SOIC (8)4.90mm × 3.91mm
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
GUID-6F63CC93-B878-4772-AEAB-8AB982A52FBF-low.gif方框图