ZHCSII6C July   2018  – January 2023 OPA855

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Thermal Information
   4. 7.4 Recommended Operating Conditions
   5. 7.5 Electrical Characteristics
   6. 7.6 Typical Characteristics
8. 8 Parameter Measurement Information
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Input and ESD Protection
      2. 9.3.2 Feedback Pin
      3. 9.3.3 Wide Gain-Bandwidth Product
      4. 9.3.4 Slew Rate and Output Stage
   4. 9.4 Device Functional Modes
      1. 9.4.1 Split-Supply and Single-Supply Operation
      2. 9.4.2 Power-Down Mode
10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
       3. 10.2.3 Application Curves
    3. 10.3 Typical Application
       1. 10.3.1 Design Requirements
       2. 10.3.2 Detailed Design Procedure
       3. 10.3.3 Application Curves
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
       1. 10.5.1 Layout Guidelines
       2. 10.5.2 Layout Example
11. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 Development Support
    2. 11.2 Documentation Support
       1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
12. 12Mechanical, Packaging, and Orderable Information