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ZHCSIL1A July 2018 – December 2018 DSLVDS1001

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		DSLVDS1001	UNIT
		DBV (SOT-23)
		5 PINS
R_θJA	Junction-to-ambient thermal resistance	179.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	88.7	°C/W
R_θJB	Junction-to-board thermal resistance	36.2	°C/W
ψ_JT	Junction-to-top characterization parameter	4.6	°C/W
ψ_JB	Junction-to-board characterization parameter	35.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).