ZHCSJ10B September 2006 – November 2018 TPS2376-H
PRODUCTION DATA.
The layout of the PoE front end must use good practices for power and EMI/ESD. A basic set of recommendations include:
Use of generous copper area on VSS and to help the PCB spread and dissipate the heat is recommended. Assuming a worst-case power dissipation of 0.4 W, the required thermal resistance may be calculated as: θJA = ( tJ_MAX - tA_MAX ) / P. A thermal resistance of 50°C/W is required for a junction temperature of 105°C at an ambient of 85°C. The effect of additional local heating on the circuit board from other devices must be considered. The thermal resistance cases provided in the dissipation rating table should be used as a guide in determining the required area.
The Layout Example provides an example of a single sided layout with liberal copper plane areas to help spread the heat. The active circuit area could be reduced by locating the small resistors on the backside of the board. The TPS2376-H PowerPad is covered by copper fill, which has multiple vias to a backside mirror-image fill. There are 5 small vias under the PowerPad per the guidelines of SLMA0002 which are masked by the graphics of the tool. The fills for RTN and VDD also help spread the heat. A copper fill clearance of 0.030 inches was used for VDD to RTN or VSS. A spacing of 0.025 inches for the full PoE voltage was met elsewhere.