ZHCSJ24A November   2018  – May 2019 TPS56339

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      TPS56339 效率
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Advanced Emulated Current Mode Control
      2. 7.3.2 Enable and Adjusting Undervoltage Lockout
      3. 7.3.3 Soft Start and Pre-Biased Soft Start
      4. 7.3.4 Voltage Reference
      5. 7.3.5 Minimum ON-time, Minimum OFF-time and Frequency Foldback at Dropout Conditions
      6. 7.3.6 Overcurrent and Undervoltage Protection
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Operation
    5. 7.5 Light-Load Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Bootstrap Capacitor Selection
      3. 8.2.3 Undervoltage Lockout Set Point
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS56339 UNIT
DDC (SOT23)
6 PINS
RθJA(2)(3) Junction-to-ambient thermal resistance 119.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.1 °C/W
RθJB Junction-to-board thermal resistance 36.7 °C/W
ΨJT Junction-to-top characterization parameter 9.4 °C/W
ΨJB Junction-to-board characterization parameter 36.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. They do not represent the performance obtained in an actual application.
(3) The real RθJA  on TPS56339EVM is about 62.4 ℃/W, test condition: VIN = 19 V, VOUT = 5 V, IOUT = 3 A, TA = 25 ℃.
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