ZHCSJD3C july 2018 – april 2023 BQ25150
PRODUCTION DATA
THERMAL METRIC(1) | BQ25152/56 | UNIT | |
---|---|---|---|
YFP (DSBGA) | |||
20-PIN | |||
RθJA | Junction-to-ambient thermal resistance (2) | 36.1 | °C/W |
RθJA | Junction-to-ambient thermal resistance | 74.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 0.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 17.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 17.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |