ZHCSJD3C july   2018  – april 2023 BQ25150

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Device Key Default Settings
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Linear Charger and Power Path
        1. 9.3.1.1 Battery Charging Process
          1. 9.3.1.1.1 Pre-Charge
          2. 9.3.1.1.2 Fast Charge
          3. 9.3.1.1.3 Pre-Charge to Fast Charge Transitions and Charge Current Ramping
          4. 9.3.1.1.4 Termination
        2. 9.3.1.2 JEITA and Battery Temperature Dependent Charging
        3. 9.3.1.3 Input Voltage Based Dynamic Power Management (VINDPM) and Dynamic Power Path Management (DPPM)
        4. 9.3.1.4 Battery Supplement Mode
      2. 9.3.2  Protection Mechanisms
        1. 9.3.2.1 Input Over-Voltage Protection
        2. 9.3.2.2 Safety Timer and I2C Watchdog Timer
        3. 9.3.2.3 Thermal Protection and Thermal Charge Current Foldback
        4. 9.3.2.4 Battery Short and Over Current Protection
        5. 9.3.2.5 PMID Short Circuit
        6. 9.3.2.6 Maximum Allowable Charging Current (IMAX)
      3. 9.3.3  ADC
        1. 9.3.3.1 ADC Operation in Active Battery Mode and Low Power Mode
        2. 9.3.3.2 ADC Operation When VIN Present
        3. 9.3.3.3 ADC Measurements
        4. 9.3.3.4 ADC Programmable Comparators
      4. 9.3.4  VDD LDO
      5. 9.3.5  Load Switch / LDO Output and Control
      6. 9.3.6  PMID Power Control
      7. 9.3.7  MR Wake and Reset Input
        1. 9.3.7.1 MR Wake or Short Button Press Functions
        2. 9.3.7.2 MR Reset or Long Button Press Functions
      8. 9.3.8  14-Second Watchdog for HW Reset
      9. 9.3.9  Faults Conditions and Interrupts ( INT)
        1. 9.3.9.1 Flags and Fault Condition Response
      10. 9.3.10 Power Good ( PG) Pin
      11. 9.3.11 External NTC Monitoring (TS)
        1. 9.3.11.1 TS Thresholds
      12. 9.3.12 External NTC Monitoring (ADCIN)
      13. 9.3.13 I2C Interface
        1. 9.3.13.1 F/S Mode Protocol
    4. 9.4 Device Functional Modes
      1. 9.4.1 Ship Mode
      2. 9.4.2 Low Power
      3. 9.4.3 Active Battery
      4. 9.4.4 Charger/Adapter Mode
      5. 9.4.5 Power-Up/Down Sequencing
    5. 9.5 Register Map
      1. 9.5.1 I2C Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input (IN/PMID) Capacitors
        2. 10.2.2.2 VDD, LDO Input and Output Capacitors
        3. 10.2.2.3 TS
        4. 10.2.2.4 IMAX Selection
        5. 10.2.2.5 Recommended Passive Components
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 静电放电警告
    7. 13.7 术语表
  15. 14Mechanical, Packaging, and Orderable Information

10.2.2.1 Input (IN/PMID) Capacitors

Low ESR ceramic capacitors such as X7R or X5R is preferred for input decoupling capacitors and should be places as close as possible to the supply and ground pins fo the IC. Due to the voltage derating of the capacitors it is recommended at 25-V rated capacitors are used for IN and PMID pins which can normally operate at 5 V. After derating the minimum capacitance must be higher than 1 µF.
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