ZHCSK12A July 2019 – October 2019 TLV320ADC6140
PRODUCTION DATA.
THERMAL METRIC(1) | TLV320ADCx140 | UNIT | |
---|---|---|---|
RTW (WQFN) | |||
24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 32.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 25.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 11.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.9 | °C/W |