ZHCSK90D september 2019 – january 2021 UCC12050
PRODUCTION DATA
THERMAL METRIC(1) | UCC12050 | UNIT | |
---|---|---|---|
DVE (SOIC) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 63.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 21.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 38.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 10.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 37.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |