ZHCSKJ1A December   2019  – February 2020 TLV751

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Feed-Forward Capacitor (CFF)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

5 Pin Configuration and Functions

DSQ Package
10-Pin Adjustable WSON
Top View
DSQ Package
10-Pin Adjustable WSON
Top View
TLV751 DSQ_Pinout_sbvs385_Fixed.gif

Pin Functions

PIN I/O DESCRIPTION
NAME DSQ
EN1 3 Input Enable pin. Drive EN1 greater than VEN1(HI) to turn on the regulator.
Drive EN1 less than VEN1(LO) to put the low-dropout (LDO) regulator into shutdown mode.
EN2 5 Input Enable pin. Drive EN2 greater than VEN2(HI) to turn on the regulator.
Drive EN2 less than VEN2(LO) to put the LDO into shutdown mode.
FB1/ NC 1 — For the adjustable TLV75101, this pin is used as an input to the control loop error amplifier and is used to set the output voltage of the LDO.
For the fixed TLV751xxxyyy, this is not connected internally.
FB2 / NC 7 — For the adjustable TLV75101, this pin is used as an input to the control loop error amplifier and is used to set the output voltage of the LDO.
For the fixed TLV751xxxyyy, this is not connected internally.
GND 2, 4 — Ground pin
IN1 9 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the input capacitor as close to the output of the device as possible.
IN2 6 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the input capacitor as close to the output of the device as possible.
OUT1 10 Output Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the output capacitor as close to output of the device as possible.
OUT2 8 Output Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the output capacitor as close to output of the device as possible.
Thermal pad — Connect the thermal pad to a large area GND plane for improved thermal performance.
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