ZHCSLA3A May   2020  – December 2020 LM7481-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge Pump
      2. 8.3.2 Dual Gate Control (DGATE, HGATE)
        1. 8.3.2.1 Reverse Battery Protection (A, C, DGATE)
        2. 8.3.2.2 Load Disconnect Switch Control (HGATE, OUT)
      3. 8.3.3 Over Voltage Protection and Battery Voltage sensing (VSNS, SW, OV)
      4. 8.3.4 Low Iq Shutdown and Under Voltage Lockout (EN/UVLO)
    4. 8.4 Device Functional Modes
    5. 8.5 Application Examples
      1. 8.5.1 Redundant Supply OR-ing with Inrush Current Limiting, Over Voltage Protection and ON/OFF Control
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical 12-V Reverse Battery Protection Application
      1. 9.2.1  Design Requirements for 12-V Battery Protection
      2. 9.2.2  Automotive Reverse Battery Protection
      3. 9.2.3  Input Transient Protection: ISO 7637-2 Pulse 1
      4. 9.2.4  AC Super Imposed Input Rectification: ISO 16750-2 and LV124 E-06
      5. 9.2.5  Input Micro-Short Protection: LV124 E-10
      6. 9.2.6  Detailed Design Procedure
        1. 9.2.6.1 Design Considerations
        2. 9.2.6.2 Charge Pump Capacitance VCAP
        3. 9.2.6.3 Input and Output Capacitance
        4. 9.2.6.4 Hold-up Capacitance
        5. 9.2.6.5 Over Voltage Protection and Battery Monitor
      7. 9.2.7  MOSFET Selection: Blocking MOSFET Q1
      8. 9.2.8  MOSFET Selection: Hot-Swap MOSFET Q2
      9. 9.2.9  TVS selection
      10. 9.2.10 Application Curves
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 TVS Selection for 12-V Battery Systems
    3. 10.3 TVS Selection for 24-V Battery Systems
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Layout Guidelines

  • For the ideal diode stage, connect A, DGATE and C pins of LM74810-Q1 close to the MOSFET's SOURCE, GATE and DRAIN pins.
  • For the load disconnect stage, connect HGATE and OUT pins of LM74810-Q1 close to the MOSFET's GATE and SOURCE pins.

  • The high current path of for this solution is through the MOSFET, therefore it is important to use thick and short traces for source and drain of the MOSFET to minimize resistive losses.
  • The DGATE pin of the LM74810-Q1 must be connected to the MOSFET GATE with short trace.

  • Place transient suppression components close to LM74810-Q1.

  • Place the decopuling capacitor, CVS close to VS pin and chip GND.

  • The charge pump capacitor across CAP and VS pins must be kept away from the MOSFET to lower the thermal effects on the capacitance value.
  • Obtaining acceptable performance with alternate layout schemes is possible, however the layout shown in the Layout Example is intended as a guideline and to produce good results.