ZHCSLL2A May   2021  – March 2022 TPS25830A-Q1 , TPS25832A-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Buck Regulator
      2. 10.3.2  Enable/UVLO and Start-Up
      3. 10.3.3  Switching Frequency and Synchronization (RT/SYNC)
      4. 10.3.4  Spread-Spectrum Operation
      5. 10.3.5  VCC, VCC_UVLO
      6. 10.3.6  Minimum ON-Time, Minimum OFF-Time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Bootstrap Voltage (BOOT)
      9. 10.3.9  RSNS, RSET, RILIMIT and RIMON
      10. 10.3.10 Overcurrent and Short Circuit Protection
        1. 10.3.10.1 Current Limit Setting using RILIMIT
        2. 10.3.10.2 Current Limit Setting for MFI OCP
        3. 10.3.10.3 Buck Average Current Limit Design Example
        4. 10.3.10.4 External MOSFET Gate Drivers
        5. 10.3.10.5 Cycle-by-Cycle Buck Current Limit
      11. 10.3.11 Overvoltage, IEC and Short to Battery Protection
        1. 10.3.11.1 VBUS and VCSN/OUT Overvoltage Protection
        2. 10.3.11.2 DP_IN and DM_IN Protection
        3. 10.3.11.3 CC IEC and OVP Protection
      12. 10.3.12 Cable Compensation
        1. 10.3.12.1 Cable Compensation Design Example
      13. 10.3.13 USB Port Control
      14. 10.3.14 FAULT Response
      15. 10.3.15 USB Specification Overview
      16. 10.3.16 USB Type-C® Basics
        1. 10.3.16.1 Configuration Channel
        2. 10.3.16.2 Detecting a Connection
        3. 10.3.16.3 Configuration Channel Pins CC1 and CC2
        4. 10.3.16.4 Current Capability Advertisement and VCONN Overload Protection
        5. 10.3.16.5 Plug Polarity Detection
      17. 10.3.17 Device Power Pins (IN, CSN/OUT, and PGND)
      18. 10.3.18 Thermal Shutdown
      19. 10.3.19 Power Wake
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Standby Mode
      3. 10.4.3 Active Mode
      4. 10.4.4 Device Truth Table (TT)
      5. 10.4.5 USB Port Operating Modes
        1. 10.4.5.1 USB Type-C® Mode
        2. 10.4.5.2 Standard Downstream Port (SDP) Mode — USB 2.0, USB 3.0, and USB 3.1
        3. 10.4.5.3 Charging Downstream Port (CDP) Mode
        4. 10.4.5.4 Client Mode
      6. 10.4.6 High-Bandwidth Data-Line Switches
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1  Output Voltage
        2. 11.2.2.2  Switching Frequency
        3. 11.2.2.3  Inductor Selection
        4. 11.2.2.4  Output Capacitor Selection
        5. 11.2.2.5  Input Capacitor Selection
        6. 11.2.2.6  Bootstrap Capacitor Selection
        7. 11.2.2.7  VCC Capacitor Selection
        8. 11.2.2.8  Enable and Undervoltage Lockout Set-Point
        9. 11.2.2.9  Current Limit Set-Point
        10. 11.2.2.10 Cable Compensation Set-Point
        11. 11.2.2.11 LD_DET, POL, and FAULT Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Ground Plane and Thermal Considerations
    3. 13.3 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 接收文档更新通知
    4. 14.4 支持资源
    5. 14.5 Trademarks
    6. 14.6 静电放电警告
    7. 14.7 术语表
  15. 15Mechanical, Packaging, and Orderable Information

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000(2) V
Charged device model (CDM), per AEC Q100-011 Corner pins (1, 8, 9, 17, 25 and 32) ±750(3)
Other pins ±750(3)
IEC 61000-4-2 contact discharge DP_IN, DM_IN, CC1 and CC2 pins ±8000(4)
IEC 61000-4-2 air-gap discharge DP_IN, DM_IN, CC1 and CC2 pins ±15000(4)
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) The passing level per AEC-Q100 Classification H2.
(3) The passing level per AEC-Q100 Classification C5.
(4) Surges per IEC61000-4-2, 1999 applied between DP_IN, DM_IN, CC1, CC2 and output ground of the TPS2583x-Q1 evaluation module. Addition 0.22u cap is needed on CCx pins.
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