ZHCSLN8A November   2020  – May 2021 DAC61404 , DAC81404

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: Write, IOVDD: 1.7 V to 2.7 V
    7. 7.7  Timing Requirements: Write, IOVDD: 2.7 V to 5.5 V
    8. 7.8  Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 1.7 V to 2.7 V
    9. 7.9  Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 1.7 V to 2.7 V
    10. 7.10 Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 2.7 V to 5.5 V
    11. 7.11 Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 2.7 V to 5.5 V
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 R-2R Ladder DAC
      2. 8.3.2 Programmable-Gain Output Buffer
        1. 8.3.2.1 Sense Pins
      3. 8.3.3 DAC Register Structure
        1. 8.3.3.1 DAC Output Update
          1. 8.3.3.1.1 Synchronous Update
          2. 8.3.3.1.2 Asynchronous Update
        2. 8.3.3.2 Broadcast DAC Register
        3. 8.3.3.3 Clear DAC Operation
      4. 8.3.4 Internal Reference
      5. 8.3.5 Power-On Reset (POR)
        1. 8.3.5.1 Hardware Reset
        2. 8.3.5.2 Software Reset
      6. 8.3.6 Thermal Alarm
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Stand-Alone Operation
      2. 8.5.2 Daisy-Chain Operation
      3. 8.5.3 Frame Error Checking
    6. 8.6 Register Map
      1. 8.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 8.6.2  DEVICEID Register (address = 01h) [reset = 0A60h or 0920h]
      3. 8.6.3  STATUS Register (address = 02h) [reset = 0000h]
      4. 8.6.4  SPICONFIG Register (address = 03h) [reset = 0AA4h]
      5. 8.6.5  GENCONFIG Register (address = 04h) [reset = 4000h]
      6. 8.6.6  BRDCONFIG Register (address = 05h) [reset = 000Fh]
      7. 8.6.7  SYNCCONFIG Register (address = 06h) [reset = 0000h]
      8. 8.6.8  DACPWDWN Register (address = 09h) [reset = FFFFh]
      9. 8.6.9  DACRANGE Register (address = 0Ah) [reset = 0000h]
      10. 8.6.10 TRIGGER Register (address = 0Eh) [reset = 0000h]
      11. 8.6.11 BRDCAST Register (address = 0Fh) [reset = 0000h]
      12. 8.6.12 DACn Register (address = 10h to 13h) [reset = 0000h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) DACx1404 UNIT
RHB (VQFN)
32 PINS
RΘJA Junction-to-ambient thermal resistance 29.3 ℃/W
RΘJC(top) Junction-to-case (top) thermal resistance 17.0 ℃/W
RΘJB Junction-to-board thermal resistance 9.5 ℃/W
ΨJT Junction-to-top characterization parameter 0.2 ℃/W
ΨJB Junction-to-board characterization parameter 9.5 ℃/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance 1.1 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |