The device incorporates a thermal shutdown that is triggered when the die temperature exceeds 140°C. A thermal shutdown sets the TEMP-ALM bit, and causes all DAC outputs to power-down; however, the internal reference remains powered on. The FAULT pin can be configured to monitor a thermal shutdown condition by setting the TEMPALM-EN bit. After a thermal shutdown is triggered, the device stays in shutdown even after the device temperature lowers.

The die temperature must fall to less than 140°C before the device can be returned to normal operation. To resume normal operation, the thermal alarm must be cleared through the ALM-RESET bit while the DAC channels are in power-down mode.