ZHCSLP5D June   2007  – June 2021 TRS3232E

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics — Device
    7. 6.7 Electrical Characteristics — Driver
    8. 6.8 Electrical Characteristics — Receiver
    9. 6.9 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC Powered by 3 V to 5.5 V
      2. 8.4.2 VCC Unpowered, VCC = 0 V
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.5 Thermal Information

THERMAL METRIC(1)TRS3232EUNIT
PW (TSSOP)D (SOIC)DW (SOIC)DB (SSOP)RGT (VQFN)
16 PINS16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance108.285.972.3103.148.8°C/W
RθJCtopJunction-to-case (top) thermal resistance39.043.133.549.255.8°C/W
RθJBJunction-to-board thermal resistance54.444.537.1

54.8

23.2°C/W
ψJTJunction-to-top characterization parameter3.310.17.512.01.7°C/W
ψJBJunction-to-board characterization parameter53.844.137.1

54.1

23.2°C/W
RθJCbotJunction-to-case (bottom) thermal resistance

N/A

N/A

N/A

N/A

9.0°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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