ZHCSLT5C December 2009 – October 2020 TPS2560 , TPS2561
PRODUCTION DATA
6 Pin Configuration and Functions
DRC Package,10-Pin VSON,Top ViewTable 6-1 Pin Functions
| PIN | I/O | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | TPS2560 | TPS2561 | ||
| EN1 | 4 | — | I | Enable input, logic low turns on channel one power switch. |
| EN1 | — | 4 | I | Enable input, logic high turns on channel one power switch. |
| EN2 | 5 | — | I | Enable input, logic low turns on channel two power switch. |
| EN2 | — | 5 | I | Enable input, logic high turns on channel two power switch. |
| GND | 1 | 1 | — | Ground connection; connect externally to the thermal pad. |
| IN | 2, 3 | 2, 3 | I | Input voltage; connect a 0.1 μF or greater ceramic capacitor from IN to GND as close to the IC as possible. |
| FAULT1 | 10 | 10 | O | Active-low open-drain output, asserted during overcurrent or overtemperature condition on channel one. |
| FAULT2 | 6 | 6 | O | Active-low open-drain output, asserted during overcurrent or overtemperature condition on channel two. |
| OUT1 | 9 | 9 | O | Power-switch output for channel one. |
| OUT2 | 8 | 8 | O | Power-switch output for channel two. |
| ILIM | 7 | 7 | O | External
resistor used to set current-limit threshold; recommended 20 kΩ ≤ RILIM ≤ 187 kΩ. |
| Thermal pad | PAD | PAD | — | Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect the thermal pad to GND pin externally. |