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ZHCSLT5C December 2009 – October 2020 TPS2560 , TPS2561

PRODUCTION DATA

7.5 Thermal Information

THERMAL METRIC⁽¹⁾		TPS256x	UNIT
		DRC (VSON)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	47.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	66.2	°C/W
R_θJB	Junction-to-board thermal resistance	22.4	°C/W
ψ_JT	Junction-to-top characterization parameter	1.6	°C/W
ψ_JB	Junction-to-board characterization parameter	22.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.