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ZHCSLY9A October 2020 – December 2020 LM7310

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC ⁽¹⁾		LM73100	UNIT
		RPW (QFN)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	41.7 ⁽²⁾	°C/W
R_θJA	Junction-to-ambient thermal resistance	74.5 ⁽³⁾	°C/W
Ψ_JT	Junction-to-top characterization parameter	1	°C/W
Ψ_JB	Junction-to-board characterization parameter	20 ⁽²⁾	°C/W
Ψ_JB	Junction-to-board characterization parameter	27.6 ⁽³⁾	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) Based on simulations conducted with the device mounted on a custom 4-layer PCB (2s2p) with 8 thermal vias under device

(3) Based on simulations conducted with the device mounted on a JEDEC 4-layer PCB (2s2p) with no thermal vias under device