The TPS65988DK features a central thermal shutdown as well as independent thermal sensors for each internal power path. The central thermal shutdown monitors the overall temperature of the die and disables all functions except for supervisory circuitry when die temperature goes above a rising temperature of TSD_MAIN. The temperature shutdown has a hysteresis of TSDH_MAIN and when the temperature falls back below this value, the device resumes normal operation.

The power path thermal shutdown monitors the temperature of each internal power path and disables the power path in response to an overtemperature event. Once the temperature falls below TSDH_PWR the path can be configured to resume operation or remain disabled until re-enabled by firmware.