ZHCSM11A October   2020  – May 2024 TMUX1575

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  IPOFF Leakage Current
    5. 6.5  Transition Time
    6. 6.6  tON (EN) and tOFF (EN) Time
    7. 6.7  Break-Before-Make Delay
    8. 6.8  Charge Injection
    9. 6.9  Off Isolation
    10. 6.10 Channel-to-Channel Crosstalk
    11. 6.11 Bandwidth
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Beyond Supply Operation
      3. 7.3.3 1.2V Logic Compatible Inputs
      4. 7.3.4 Powered-off Protection
      5. 7.3.5 Fail-Safe Logic
      6. 7.3.6 Integrated Pull-Down Resistors
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

5.4 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
YCJ (WCSP)
16 PINS
RθJA Junction-to-ambient thermal resistance 89.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.4 °C/W
RθJB Junction-to-board thermal resistance 0.6 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 21.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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