ZHCSMX2B June   2007  – July 2021 TRS3221E

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Driver Section Electrical Characteristics
    8. 6.8  Driver Section Switching Characteristics
    9. 6.9  Receiver Section Electrical Characteristics
    10. 6.10 Receiver Section Switching Characteristics
    11. 6.11 Auto-Powerdown Section Electrical Characteristics
    12. 6.12 Auto-Powerdown Section Switching Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
      4. 8.3.4 RS232 Status
    4. 8.4 Device Functional Modes
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
    5. 9.5 Application Curve
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

6.5 Thermal Information

THERMAL METRIC(1)TRS3221EUNIT
DB (SSOP)PW (TSSOP)RGT (VQFN)
16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance

105.8

110.952.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.941.760.6°C/W
RθJBJunction-to-board thermal resistance

57.6

57.226.8°C/W
ψJTJunction-to-top characterization parameter

14.1

4.22.5°C/W
ψJBJunction-to-board characterization parameter56.856.626.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

N/A

N/A

12.0

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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