米6体育平台手机版

ZHCSN67N July 1997 – April 2021 SN55LVDS31 , SN65LVDS31 , SN65LVDS3487 , SN65LVDS9638

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN55LVDS31			SN65LVDS31			SN65LVDS3487		SN65LVDS9638			UNIT
		FK	J	W	D	NS	PW	D	PW	D	DGK	DGN⁽²⁾
		20 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance				84.8	86.0					179.5		°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance				46.0	44.2					72.3
R_θJB	Junction-to-board thermal resistance				41.8	26.4					101.5
ψ_JT	Junction-to-top characterization parameter				11.1	10.9					11
ψ_JB	Junction-to-board characterization parameter				41.5	46.1					99.7
Power Rating	T_A ≤ 25°C	1375	1375	1000	950	—	774	950	774	725	425	2140	mW
	T_A ≤ 70°C	880	880	640	608	—	496	608	496	464	272	1370
	T_A ≤ 85°C	715	715	520	494	—	402	494	402	377	221	1110
	T_A ≤ 125°C	275	275	200	—	—-	—	—	—	—	—	—

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. See the application note PowerPAD Thermally Enhanced Package (SLMA002).