–40°C ≤ T_A = T_J ≤ +125°C, V_(IN) = V_{(P_IN)} = 24 V, V_{( SHDN)} = 2 V, R_(ILIM) = 30 kΩ, IMON = PGOOD =  FLT = OPEN, C_(OUT) = 1 μF, C_(dVdT) = OPEN. (Unless stated otherwise)

Figure 6-1 On-Resistance vs Temperature Across Load Current

Figure 6-3 Input Supply Current vs Supply Voltage During Normal Operation

Figure 6-5 Current Monitor Gain vs Output Current

Taken on VQFN device with 95 cm2 copper connected to Exposed PAD

Figure 6-7 Thermal Shutdown Time vs Power Dissipation for RGE Package

Figure 6-2 Input Supply Current vs Supply Voltage in Shutdown

Figure 6-4 Overload Current Limit vs Temperature

IOUT = 4.5 A

Figure 6-6 IMON Offset vs Temperature

Taken on HTSSOP with 110 cm2 copper connected to Exposed PAD

Figure 6-8 Thermal Shutdown Time vs Power Dissipation for PWP Package