For all the applications, a 0.1 µF or higher value ceramic decoupling capacitor is recommended between IN terminal and GND.
High current carrying power path connections must be as short as possible and must be sized to carry at least twice the full-load current. See Figure 11-1 and Figure 11-2 for a typical PCB layout example.
Locate all the TPS16530 device support components
R(ILIM), C(dVdT), R(IMON), UVLO resistors
close to the device pin. Connect the other end of the component to the GND with
shortest trace length.
The trace routing for the R(ILIM)
component to the device must be as short as possible to reduce parasitic effects
on the current limit accuracy. These traces must not have any coupling to
switching signals on the board.
Protection devices such as TVS, snubbers,
capacitors, or diodes must be placed physically close to the device they are
intended to protect and routed with short traces to reduce inductance. For
example, a protection Schottky diode is recommended to address negative
transients due to switching of inductive loads, and it must be physically close
to the OUT and GND pins.
Thermal Considerations: When properly mounted,
the PowerPAD package provides significantly greater cooling ability. To operate
at rated power, the PowerPAD must be soldered directly to the board GND plane
directly under the device. Other planes, such as the bottom side of the circuit
board, can be used to increase heat sinking in higher current applications.