ZHCSNM5C november   2020  – august 2023 UCC25800-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Management
      2. 8.3.2 Oscillator
      3. 8.3.3 External Synchronization
      4. 8.3.4 Dead-Time
        1. 8.3.4.1 Adaptive Dead-time
        2. 8.3.4.2 Maximum Programmable Dead-time
      5. 8.3.5 Protections
        1. 8.3.5.1 Overcurrent Protection
          1. 8.3.5.1.1 OCP Threshold Setting
          2. 8.3.5.1.2 Output Power Capability
        2. 8.3.5.2 Input Overvoltage Protection (OVP)
        3. 8.3.5.3 Over-Temperature Protection (TSD)
        4. 8.3.5.4 Pin-Fault Protections
        5. 8.3.5.5 VREG Pin Protection
      6. 8.3.6 DIS/FLT Pin operation
        1. 8.3.6.1 FAULT Codes
    4. 8.4 Device Functional Modes
      1. 8.4.1 UVLO Mode
      2. 8.4.2 Soft-start Mode
      3. 8.4.3 Normal Operation Mode
      4. 8.4.4 Disabled Mode
      5. 8.4.5 Fault Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 LLC Converter Operation Principle
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 What to Do and What Not to Do
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  14. 13Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) UCC25800-Q1 UNIT
DGN (HVSSOP)
8 PINS
RΘJA Junction-to-ambient thermal resistance 47.9 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 59.1 °C/W
RΘJB Junction-to-board thermal resistance 18.4 °C/W
ψJT Junction-to-top characterization parameter 1.6 °C/W
ψJB Junction-to-board characterization parameter 18.4 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance 5.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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