ZHCSO54A May   2021  – November 2021 CC1352P7

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1. 3.1 功能方框图
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram – RGZ Package (Top View)
    2. 6.2 Signal Descriptions – RGZ Package
    3. 6.3 Connections for Unused Pins and Modules
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption - Power Modes
    6. 7.6  Power Consumption - Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861 MHz to 1054 MHz - Receive (RX)
    11. 7.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 7.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 7.18.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 7.18.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 7.18.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 7.18.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.18.4 Synchronous Serial Interface (SSI) Characteristics
        1. 7.18.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       40
      5. 7.18.5 UART
        1. 7.18.5.1 UART Characteristics
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 ADC
        1. 7.19.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.19.2 DAC
        1. 7.19.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.19.3 Temperature and Battery Monitor
        1. 7.19.3.1 Temperature Sensor
        2. 7.19.3.2 Battery Monitor
      4. 7.19.4 Comparators
        1. 7.19.4.1 Low-Power Clocked Comparator
        2. 7.19.4.2 Continuous Time Comparator
      5. 7.19.5 Current Source
        1. 7.19.5.1 Programmable Current Source
      6. 7.19.6 GPIO
        1. 7.19.6.1 GPIO DC Characteristics
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  8. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
      2. 8.3.2 Bluetooth 5.2 Low Energy
      3. 8.3.3 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  9. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating ambient temperature(1)(3) –40 105 °C
Operating junction temperaturehrefhref –40 115 °C
Operating supply voltage (VDDS) 1.8 3.8 V
Operating supply voltage (VDDS), boost mode
 		 VDDR = 1.95 V
+14 dBm RF output sub-1 GHz power amplifier		 2.1 3.8 V
Rising supply voltage slew rate 0 100 mV/µs
Falling supply voltage slew rate(2) 0 20 mV/µs
(1) Operation at or near maximum operating temperature for extended durations will result in a reduction in lifetime.
(2) For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor must be used to ensure compliance with this slew rate.
(3) For thermal resistance characteristics refer to Section 7.8. 
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