ZHCSOO3A May   2021  – December 2021

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Pin Configurations and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings IEC Specification
    4. 7.4 Recomended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  VSUP Pin
      2. 9.3.2  VFLT Pin
      3. 9.3.3  Digital Inputs and Outputs
        1. 9.3.3.1 TXD Pin
        2. 9.3.3.2 RXD Pin
        3. 9.3.3.3 TS Pin
      4. 9.3.4  Digital Control and Timing
      5. 9.3.5  VIO Pin
      6. 9.3.6  GND
      7. 9.3.7  INH Pin
      8. 9.3.8  WAKE Pin
      9. 9.3.9  CAN Bus Pins
      10. 9.3.10 Local Faults
        1. 9.3.10.1 TXD Dominant Timeout (TXD DTO)
        2. 9.3.10.2 Thermal Shutdown (TSD)
        3. 9.3.10.3 Under/Over Voltage Lockout
        4. 9.3.10.4 Unpowered Devices
        5. 9.3.10.5 Floating Terminals
        6. 9.3.10.6 CAN Bus Short Circuit Current Limiting
        7. 9.3.10.7 Sleep Wake Error Timer
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Mode Description
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Standby Mode
        3. 9.4.1.3 Sleep Mode
          1. 9.4.1.3.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 9.4.1.3.2 Local Wake-Up (LWU) via WAKE Input Terminal
        4. 9.4.1.4 Fail-safe Mode
      2. 9.4.2 CAN Transceiver
        1. 9.4.2.1 CAN Transceiver Operation
        2. 9.4.2.2 CAN Transceiver Modes
          1. 9.4.2.2.1 CAN Off Mode
          2. 9.4.2.2.2 CAN Autonomous: Inactive and Active
          3. 9.4.2.2.3 CAN Active
        3. 9.4.2.3 Driver and Receiver Function Tables
        4. 9.4.2.4 CAN Bus States
  10. 10Application Information
    1. 10.1 Application Information Disclaimer
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
    3. 10.3 Application Curves
  11. 11Power Supply Requirements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

Layout Guidelines

Place the protection and filtering circuitry as close to the bus connector to prevent transients, ESD and noise from propagating onto the board. The layout example provides information on components around the device itself. Transient voltage suppression (TVS) device can be added for extra protection. The production solution can be either bi-directional TVS diode or varistor with ratings matching the application requirements. This example also shows optional bus filter capacitors.

Design the bus protection components in the direction of the signal path. Do not force the transient current to divert from the signal path to reach the protection device. Use supply and ground planes to provide low inductance.

Note:

A high-frequency current follows the path of least impedance and not the path of least resistance.

Use at least two vias for supply and ground connections of bypass capacitors and protection devices to minimize trace and via inductance.

  • Bypass and bulk capacitors should be placed as close as possible to the supply terminals of transceiver.
  • Bus termination: this layout example shows split termination. This is where the termination is split into two resistors with the center or split tap of the termination connected to ground via capacitor. Split termination provides common mode filtering for the bus. When bus termination is placed on the board instead of directly on the bus, additional care must be taken to ensure the terminating node is not removed from the bus thus also removing the termination.