ZHCSOO3A May   2021  – December 2021

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings IEC Specification
    4. 7.4 Recomended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  VSUP Pin
      2. 9.3.2  VFLT Pin
      3. 9.3.3  Digital Inputs and Outputs
        1. 9.3.3.1 TXD Pin
        2. 9.3.3.2 RXD Pin
        3. 9.3.3.3 TS Pin
      4. 9.3.4  Digital Control and Timing
      5. 9.3.5  VIO Pin
      6. 9.3.6  GND
      7. 9.3.7  INH Pin
      8. 9.3.8  WAKE Pin
      9. 9.3.9  CAN Bus Pins
      10. 9.3.10 Local Faults
        1. 9.3.10.1 TXD Dominant Timeout (TXD DTO)
        2. 9.3.10.2 Thermal Shutdown (TSD)
        3. 9.3.10.3 Under/Over Voltage Lockout
        4. 9.3.10.4 Unpowered Devices
        5. 9.3.10.5 Floating Terminals
        6. 9.3.10.6 CAN Bus Short Circuit Current Limiting
        7. 9.3.10.7 Sleep Wake Error Timer
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Mode Description
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Standby Mode
        3. 9.4.1.3 Sleep Mode
          1. 9.4.1.3.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 9.4.1.3.2 Local Wake-Up (LWU) via WAKE Input Terminal
        4. 9.4.1.4 Fail-safe Mode
      2. 9.4.2 CAN Transceiver
        1. 9.4.2.1 CAN Transceiver Operation
        2. 9.4.2.2 CAN Transceiver Modes
          1. 9.4.2.2.1 CAN Off Mode
          2. 9.4.2.2.2 CAN Autonomous: Inactive and Active
          3. 9.4.2.2.3 CAN Active
        3. 9.4.2.3 Driver and Receiver Function Tables
        4. 9.4.2.4 CAN Bus States
  10. 10Application Information
    1. 10.1 Application Information Disclaimer
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
    3. 10.3 Application Curves
  11. 11Power Supply Requirements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) HBM classification level 3A for all pin ±4000 V
HBM classification level 3A for VSUP, WAKE, INH ±8000
HBM classification level 3B for global pins CANH & CANL ±10000
Charged-device model (CDM), per AEC Q100-011
CDM classification level C5 for all pins		 ±750
(1) AEC-Q100-002 indicates that HBM stresses shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
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