ZHCSPA5F August   1999  – July 2024 THS4021 , THS4022

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information - THS4021
   5. 5.5 Thermal Information - THS4022
   6. 5.6 Electrical Characteristics - THS4021D and THS4022DGN
   7. 5.7 Electrical Characteristics - THS4021DGN
   8. 5.8 Typical Characteristics: THS4021D and THS4022DGN
   9. 5.9 Typical Characteristics: THS4021DGN
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Offset Nulling
   4. 6.4 Device Functional Modes
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Driving a Capacitive Load
      2. 7.1.2 General Configuration
   2. 7.2 Power Supply Recommendations
   3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
         1. 7.3.1.1 General PowerPAD™ Integrated Circuit Package Design Considerations
      2. 7.3.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
   2. 8.2 接收文档更新通知
   3. 8.3 支持资源
   4. 8.4 Trademarks
   5. 8.5 静电放电警告
   6. 8.6 术语表
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information