ZHCSPA5F August   1999  – July 2024 THS4021 , THS4022

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - THS4021
    5. 5.5 Thermal Information - THS4022
    6. 5.6 Electrical Characteristics - THS4021D and THS4022DGN
    7. 5.7 Electrical Characteristics - THS4021DGN
    8. 5.8 Typical Characteristics: THS4021D and THS4022DGN
    9. 5.9 Typical Characteristics: THS4021DGN
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Offset Nulling
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a Capacitive Load
      2. 7.1.2 General Configuration
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 General PowerPAD™ Integrated Circuit Package Design Considerations
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information - THS4021

THERMAL METRIC(1) THS4021 UNIT
D (SOIC) DGN (HVSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 124.5 58.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.0 4.7 °C/W
RθJB Junction-to-board thermal resistance 72.2 N/A °C/W
ΨJT Junction-to-top characterization parameter 13.6 N/A °C/W
ΨJB Junction-to-board characterization parameter 71.4 N/A °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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