ZHCSPG5 December   2021 DAC11001B

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: Write, 4.5 V ≤ DVDD ≤ 5.5 V
    7. 6.7  Timing Requirements: Write, 2.7 V ≤ DVDD < 4.5 V
    8. 6.8  Timing Requirements: Read and Daisy-Chain Write, 4.5 V ≤ DVDD ≤ 5.5 V
    9. 6.9  Timing Requirements: Read and Daisy-Chain Write, 2.7 V ≤ DVDD < 4.5 V
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter Architecture
      2. 7.3.2 External Reference
      3. 7.3.3 Output Buffers
      4. 7.3.4 Internal Power-On Reset (POR)
      5. 7.3.5 Temperature Drift and Calibration
      6. 7.3.6 DAC Output Deglitch Circuit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fast-Settling Mode and THD
      2. 7.4.2 DAC Update Rate Mode
    5. 7.5 Programming
      1. 7.5.1 Daisy-Chain Operation
      2. 7.5.2 CLR Pin Functionality and Software Clear
      3. 7.5.3 Output Update (Synchronous and Asynchronous)
        1. 7.5.3.1 Synchronous Update
        2. 7.5.3.2 Asynchronous Update
      4. 7.5.4 Software Reset Mode
    6. 7.6 Register Map
      1. 7.6.1 NOP Register (address = 00h) [reset = 0x000000h for bits [23:0]]
      2. 7.6.2 DAC-DATA Register (address = 01h) [reset = 0x000000h for bits [23:0]]
      3. 7.6.3 CONFIG1 Register (address = 02h) [reset = 004C80h for bits [23:0]]
      4. 7.6.4 DAC-CLEAR-DATA Register (address = 03h) [reset = 000000h for bits [23:0]]
      5. 7.6.5 TRIGGER Register (address = 04h) [reset = 000000h for bits [23:0]]
      6. 7.6.6 STATUS Register (address = 05h) [reset = 000000h for bits [23:0]]
      7. 7.6.7 CONFIG2 Register (address = 06h) [reset = 000040h for bits [23:0]]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Source Measure Unit (SMU)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High-Precision Control Loop
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Arbitrary Waveform Generation (AWG)
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Interfacing to a Processor
      2. 8.3.2 Interfacing to a Low-Jitter LDAC Source
      3. 8.3.3 Embedded Resistor Configurations
        1. 8.3.3.1 Minimizing Bias Current Mismatch
        2. 8.3.3.2 2x Gain Configuration
        3. 8.3.3.3 Generating Negative Reference
    4. 8.4 What to Do and What Not to Do
      1. 8.4.1 What to Do
      2. 8.4.2 What Not to Do
    5. 8.5 Initialization Set Up
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Supply Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Assembly Effects on Precision
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DAC11001B UNIT
PFB (TQFP)
48 PINS
RθJA Junction-to-ambient thermal resistance 51.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 10.3 °C/W
RθJB Junction-to-board thermal resistance 16.2 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 16.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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